Micro-Processing Research Facility

• Karl Suss MA6 Mask Aligner – A photolithography system supporting substrates up to 100 mm (4 inches). It features a broadband mercury lamp (i-line: 365 nm), multiple exposure modes, and split-field microscope alignment with Bottom-Side Alignment (BSA) capability, achieving micron-scale resolutions.
• Model 6808 Programmable Spin Coating System – A precision spin coater designed for uniform photoresist application on wafers up to 100 mm (4 inches), with fully programmable spin profiles ensuring repeatability and control.

• AJA International ATC Orion-5 Magnetron Sputtering & Thermal Evaporation System – A versatile deposition system supporting RF and DC sputtering for metals, dielectrics, and compound semiconductors. Includes a thermal evaporator for high-purity metal deposition and substrate heating up to 850 K.
• Plasmatherm Shuttelock SLR-730-PECVD System– A plasma-enhanced chemical vapor deposition (PECVD) system for depositing silicon-based films, including SiO₂, Si₃N₄, poly-Si, and graphene, ensuring conformal coatings with precise thickness control.

• Unaxis Shuttelock SLR-760-RIE System– The capacitively coupled reactive ion etching is designed for anisotropic etching of silicon and other materials using fluorine chemistry. It also supports oxygen plasma etching for organic material removal and surface treatments.

• MTI EQ-GSL-1500X-50 – A compact high-temperature tube furnace reaching 1550°C, featuring SiC rod heating elements for fast heating/cooling. Ideal for material synthesis, annealing, and sintering, it includes a vacuum sealing assembly for controlled atmospheres. A high-precision SCR digital controller ensures ±1°C accuracy with 51-segment programmability for precise temperature control.
• MTI OTF-1200X – A split-tube furnace for semiconductor annealing and materials research, operating up to 1200°C with controlled gas flow. It includes a KF25 gas outlet, digital vacuum gauge, and an OMEGA thermocouple for precise temperature monitoring. The split design allows easy sample handling, while its 30-segment controller ensures ±1°C accuracy for stable thermal processing.

• Harrick Plasma Cleaner – A plasma surface treatment system for removing organic contaminants and enhancing adhesion for microfabrication processes.
• Novascan UV/Ozone Cleaner – A High-performance systems for atomic-level surface cleaning, resist stripping, wafer preparation, and chemical surface modification. Widely used in nanotechnology, semiconductor research, and material sciences for precision cleaning and surface treatment.
• Ultrasonic Cleaners – Used for precision cleaning of substrates, ensuring contamination-free processing.
• MTI Polishing Machine – Used for high-precision polishing of crystal components, semiconductor wafers, and ceramic substrates. It functions with fixtures for automated sample processing.

• WYKO NT8000 Optical Profiling System – A white-light interferometry-based profiler for 3D surface measurements with sub-nanometer resolution, essential for characterizing step heights and roughness in microfabrication.
• Zeiss Axio Lab.A1 Microscope – A high-resolution optical microscope with 10X, 50X, and 100X objectives, supporting brightfield and darkfield imaging for material inspection and defect analysis.

MPRF provides a comprehensive suite of electrical and materials characterization tools to support semiconductor and thin-film research:

• Four-Point Probe – Precise resistivity and conductivity measurements
• Hall Effect & Van der Pauw Measurements – Carrier concentration and mobility analysis
• Current-Voltage-Temperature (IVT) Measurements
• Capacitance-Voltage (CV) Measurements

These capabilities enable thorough evaluation of electronic, optoelectronic, and quantum devices, ensuring optimized performance and material properties.